What we offer

We offer assembly of electronic components using the following technologies: 

• single-sided and double-sided surface mounting;
• assembly of through hole components. 
• We also offer comprehensive services including:
• designing electronic units;
• production of printed circuit boards in the Department for Printed Circuit Board Technology;
• testing boards according to the customer’s instructions;
• purchasing components (items) for assembly;
• (SMT, THT) assembly;
• paste spreading mould. 

As part of the standard surface mounting we offer:

• precise soldering paste spreading with the use of the print method and metal or polyimide moulds (for short series);
• automatic arrangement of components starting from small sizes type R/C (from 0201) to large components: PLCC, PBGA, QFP;
• reflow soldering in the convection furnace;
• control of mounted electronic assemblies.

As part of the mixed assembly we offer:

• application of adhesive drops using a dosing head;
• soldering paste spreading with the use of the print method through a mould;
• automatic arrangement of SMD components;
• manual assembly of through hole components;
• soldering during one operation on a solder unit of SMD and through hole components;
• control of mounted electronic assemblies; 
• moulds for paste printing in SMT technology made of polyimide foil.

Advantages of laser cut polymer moulds:

• Polymer moulds, due to their greater flexibility compared to metal moulds, have better contact with the board surface during the printing process and therefore enable more precise printing of paste or adhesive.
• They facilitate quick and precise alignment and positions of the moulds against the board mosaic (transparency of the polyimide foil).
• They demonstrate higher resistance to permanent deformations when exposed to impact.
• They demonstrate high mechanical stability which ensures repeatability of paste application onto soldering fields of the board.
• They have a ‘dimension memory’ – an option of returning to the input dimensions or close to input dimensions following the end of exposure.
• They are resistant to typical solvents used for cleaning moulds.
• They are ideal for use in complex printed circuits, in particular those with fine-pitch soldering fields, BGA, CSP, etc.
• They are characterised by a lack of trough-shaped walls, typical for etched metal moulds.
• Laser cut holes in the moulds have straight walls (slightly trapezoidal) which guarantee complete release of the soldering paste from the moulds lifted up after the printing process. This prevents the situation where some of the paste remains in the mould and only some of paste is transferred to the soldering field of the printed circuit, which may have a negative impact on the quality of solder joints.
• It is not necessary to use any film as an adapter. Files saved in GERBER format are used directly to control the laser cutting machine.
• Short lead time (there is no need to send plates; the emailed data is sufficient).
• The price of these moulds is clearly lower than the price of laser cut metal moulds, and in the case of a small and medium number of windows in the mould, even lower than the price of metal moulds produced traditionally with using the etching technique.

Technical parameters:

• Material: Kapton®500HN
• Thickness: 100 or 125 µm
• Tensile strength (at 3% elongation): 69 MPa
• Tensile strength (at sample break): 221 MPa
• Water absorption: 2.8%

1. We accept orders for prototype batches as well as medium and long series.
2. The price of services included in every order is estimated on an individual basis.
3. Orders are performed quickly and in a timely manner. Offers are customised.
4. We guarantee the highest quality of electronic assembly with the use of lead-free and traditional technology.
5. We work on the basis of ISO 9001:2009 quality standards and the Environment Management System confirmed with the Cleaner Production Certificate No. 230/2006.
6. Together with the Research Centre for Electronic Technology, we conduct research and development, implementation and training in advanced technologies for the mounting electronic assemblies and necessary soldering materials, which take into account the problems associated with growing density of connection as well as environmental protection requirements.

Our advantage in the production and assembly of printed circuits is:

• many years of technological experience;
• trained personnel;
• strict control of technological parameters;
• automated high efficiency assembly line;
• X-Ray control of mounted electronic assemblies.