Experienced specialists and modern equipment make it possible to determine the parameters of printed circuit boards, soldering materials and subassemblies used in the assembly of electronic products which affect the quality of the finished product. The objective of the research conducted is to optimise the parameters of technological operations used in the assembly of electronic components and the prices of mounted electronic assemblies. They enable the identification of sources of technological problems and contribute to solving disputes between contracting parties.
The Research Centre for Electronic Technology ITR research includes:
- technological problems related to the quality of materials and parameters of technological operations applied in electronic assembly technologies;
- thickness and quality of final coatings on printed circuit boards;
- testing of metallographic specimens of printed circuit boards, soldering joints and electronic components;
- level of ionic impurities on electronic assemblies and their components;
- wetting properties of solder alloys (wetting strength, time and angle);
- quality of fluxing agents (including but not limited to activity, impurities brought, corrosivity);
- quality of soldering pastes (wettability of printed board layers, coalescence, settling);
- external and internal structure of printed circuit boards and solder joints with the use microscope and X-ray methods;
- quality and thickness of intermetallic compounds in solder joints;
- compliance of electronic products and their parts with the RoHS directive.
The research is carried out on the basis of current IPC, IEC, PN-EN, ISO and customer requirements.
Scope of research:
- Research into properties of soldering materials
- Solderability tests for alloys, fluxing agents, soldering pastes
- Research on climate and reliability
- Assessment of quality and structure of solder joints
- Metallographic sections
- SEM-EDX, IMC analyses
- X-ray analyses
- Microscopic analyses and measurements
- Analysis of composition or layer thickness using the XRF method
- Analysis of compliance with RoHS2
- Analysis of ionic cleanliness
- Solving unusual assembly problems
- Opinions and expert opinions
