X-ray tests are conducted on a modern device for X-ray analysis of printed circuit boards with the possibility of X-raying the boards at an angle of 70°. The software for analysing BGA, QFP, through hole filling is installed on the device.
Once the subassemblies are mounted on the printed circuit board, the quality of arrangement and soldering of the subassemblies is checked visually. This check is performed by experienced specialists with the use of optical observation under a stereoscopic microscope and on an AOI 22XDL device for automatic visual inspection. The following is checked: the shape (meniscus) of solder joints, precision of arrangement of subassemblies against soldering fields, orientation of multi-lead discrete subassemblies (QFP, SO16) and the existence of possible short-circuits between soldering fields.
