PCB production

The following ranges of technical parameters apply:

In cooperation with numerous research centres, we have been carrying out research projects dedicated to wireless sea and space communication technology. Tests are conducted on antenna technologies (development of 2.5D and other special structures), detection of defects in printed circuits (e.g. CAF, Black Pads) and repair of PCB failures. Operating within the structure of the Tele and Radio Research Institute, the Department for Printed Circuit Board Technology has been producing prototype, short and medium series of precision printed circuit boards professionally for several decades. It specialises in the construction of custom boards based on special structures such as, for example, flexible boards, flex-rigid boards, Teflon and aluminium-based boards, multilayer boards and custom structures. Many years of experience in manufacturing printed circuits enable us to develop technologies tailored to the customer’s needs. We often use non-standard materials in PCB production (polyimide foils with silicone or acrylic glue, 12 µm Inconel 600 alloy foil, adhesive films etc.).

We produce boards with a base thickness ranging from 0.05 to 4.0 mm (in special cases on thinner laminates provided by the customer) with copper which is from 9 to 200 µm thick (in the case of copper radiators we can use copper which is 350, 400 µm or 1 mm thick). We produce circuits on FR4, FR408, 370HR, PET, PEN, polyimide, Teflon laminates on a brass, aluminium or ceramic base.

We also offer boards with built-in resistors (Ohmega Ply) inside the printed circuit board.

Our customers include leading Polish and international universities and institutes, as well as companies operating in the military, automotive, electronic and other sectors.

The Institute has implemented a Quality Management System compliant with the PN-EN ISO 9001:2009 standard.